Intel Xeon E5-2630V4 processor 2.2 GHz 25 MB Smart Cache Box

Intel Xeon E5-2630V4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.1 GHz. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm

  • Intel® Xeon® E5 v4 E5-2630V4 2.2 GHz
  • 25 MB Smart Cache LGA 2011-v3
  • Processor cores: 10 14 nm 64-bit 85 W
  • Maximum internal memory supported by processor: 1.54 TB DDR4-SDRAM
  • Box Cooler included
Brand: Intel
Release date: 2016-04-04

Manufacturer no.: BX80660E52630V4

CHF 640.00
CHF 640.00
VAT incl.
  • Brand
  • Intel Xeon
  • Processor cores
  • Processor socket
  • Processor lithography
  • Cooler included
  • Box
  • Prozessorfamilie
  • Separater Grafikadapter
  • On-board graphics adapter

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Intel Xeon E5-2630V4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.1 GHz. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm

Disclaimer: Die tatsächliche Konfiguration kann von der Abbildung abweichen.

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Internal Reference: BX80660E52630V4

Intel Xeon E5-2630V4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.1 GHz. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm